Collection Overview

Scientific Reports has launched a Guest-Edited Collection on Advanced 3D packaging and integration.

Advanced 3D packaging and integration represent a transformative approach to electronic system design, enabling higher performance, reduced footprint, and enhanced functionality through vertical stacking and heterogeneous integration of components. By integrating logic, memory, sensors, and photonic or power devices within three-dimensional architectures, these technologies overcome the limitations of traditional planar scaling. Their significance lies in sustaining performance growth for high-performance computing, artificial intelligence, mobile electronics, and emerging applications where bandwidth, energy efficiency, and form factor are critical. Recent progress has been driven by innovations in through-silicon vias, wafer-level bonding, advanced interposers, and chiplet-based architectures that enable dense vertical and lateral interconnections. Advances in materials for interconnects, dielectrics, and thermal interfaces have improved electrical performance and reliability, while co-design strategies that integrate electrical, thermal, and mechanical considerations are becoming central to system optimization.

This will be a Collection of research papers and will be open for submissions from all authors – on the condition that the manuscripts fall within the scope of the Collection and of Scientific Reports more generally. Narrative review articles are also welcomed to our sister journal, Scientific Reviews. We are welcoming submissions until 11th February 2027.

Why are you excited about this Collection? 

"This topic is relevant to the current scenario in this domain as the dynamics between choosing the right materials for the application is important and there is an influx of research on advanced materials in general. So, there is a need to identify new materials with better properties that suits packaging applications. I am excited about this Collection because I will be able to review and edit latest articles in this domain as well as connect with researchers who work in this area. The impact can be advancement of knowledge on new and improved materials and technologies that are challenging in this domain and possible solutions for pressing problems that need wider and deeper investigation."- Dr. Uma Sathyakam Piratla

This Collection also supports and amplifies research related to SDG 7 - Affordable and Clean Energy.

Why submit to a Collection? 

Collections like this one help promote high-quality science. They are led by Guest Editors, who are experts in their fields, and In-House Editors and are supported by a dedicated team of Commissioning Editors and Managing Editors at Springer Nature. Collection manuscripts typically see higher citations, downloads, and Altmetric scores, and provide a one-stop-shop on a cutting-edge topic of interest. 

Who is involved? 

Guest Editors:

• Yanpeng Gong, Beijing University of Technology, China
• Ji-Wei Lian, Nanjing University of Science and Technology, China
• Shih-kang Lin, National Cheng Kung University, Taiwan
• Uma Sathyakam Piratla, Vellore Institute of Technology, India

Internal Team:

• In-House Editor: Chenyu Wang, Scientific Reports, USA
• Commissioning Editor: Quintina Dawson, Fully OA Brands, Springer Nature, UK
• Managing Editor: Eleanor Smith, Fully OA Brands, Springer Nature, UK

How can I submit my paper? 

Visit the Collection page to find out more about this Collection and how to submit your article.