Two-Dimensional Materials, the Ultimate Solution for Future Electronics and Very-Large-Scale Integrated Circuits

Two-Dimensional Materials, the Ultimate Solution for Future Electronics and Very-Large-Scale Integrated Circuits
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Two-Dimensional Materials, the Ultimate Solution for Future Electronics and Very-Large-Scale Integrated Circuits - Nano-Micro Letters

The relentless down-scaling of electronics grands the modern integrated circuits (ICs) with the high speed, low power dissipation and low cost, fulfilling diverse demands of modern life. Whereas, with the semiconductor industry entering into sub-10 nm technology nodes, degrading device performance and increasing power consumption give rise to insurmountable roadblocks confronted by modern ICs that need to be conquered to sustain the Moore law’s life. Bulk semiconductors like prevalent Si are plagued by seriously degraded carrier mobility as thickness thinning down to sub-5 nm, which is imperative to maintain sufficient gate electrostatic controllability to combat the increasingly degraded short channel effects. Nowadays, the emergence of two-dimensional (2D) materials opens up new gateway to eschew the hurdles laid in front of the scaling trend of modern IC, mainly ascribed to their ultimately atomic thickness, capability to maintain carrier mobility with thickness thinning down, dangling-bonds free surface, wide bandgaps tunability and feasibility to constitute diverse heterostructures. Blossoming breakthroughs in discrete electronic device, such as contact engineering, dielectric integration and vigorous channel-length scaling, or large circuits arrays, as boosted yields, improved variations and full-functioned processor fabrication, based on 2D materials have been achieved nowadays, facilitating 2D materials to step under the spotlight of IC industry to be treated as the most potential future successor or complementary counterpart of incumbent Si to further sustain the down-scaling of modern IC.

A groundbreaking review published in Nano-Micro Letters provides a comprehensive overview of the role of two-dimensional (2D) materials in shaping the future of electronics and integrated circuits (ICs). Authored by Laixiang Qin and Li Wang from the Ningbo Institute of Digital Twin and Eastern Institute of Technology, the review highlights the potential of 2D materials to overcome the limitations of traditional semiconductors like silicon (Si) and sustain Moore's Law in the post-Moore era.

Why This Research Matters

  • Overcoming Silicon Limitations: As the semiconductor industry approaches sub-10 nm technology nodes, traditional bulk semiconductors like Si face significant challenges, including degraded carrier mobility and increased power consumption. 2D materials, with their unique electronic properties, atomic thickness, and ability to maintain high carrier mobility even at sub-1 nm thickness, emerge as superior candidates to address these issues.
  • Enabling More-than-Moore Applications: Beyond traditional computing, modern life demands diverse applications such as 5G/6G communication, artificial intelligence, and neuromorphic computing. 2D materials offer the potential for multifunctional integration, enabling the development of flexible electronics, sensors, and in-memory computing devices that meet these advanced requirements.

Innovative Design and Mechanisms

  • 2D Materials for Electronics: The review comprehensively covers various 2D materials, including transition metal dichalcogenides (TMDCs), black phosphorus (BP), hexagonal boron nitride (h-BN), and graphene. These materials exhibit a wide range of electronic properties, from insulators to semiconductors and metals, making them suitable for diverse applications.
  • Advanced Device Structures: The study explores advanced device structures such as tunnel field-effect transistors (TFETs), negative capacitance field-effect transistors (NCFETs), and impact-ionization FETs (I-IFETs) based on 2D materials. These devices offer steep subthreshold slopes and high on/off ratios, significantly reducing power consumption and improving performance compared to traditional silicon-based devices.
  • 3D Integration and Flexible Electronics: The review highlights the potential of 2D materials for 3D monolithic integration, enabling the fabrication of high-density, low-power integrated circuits. Additionally, the mechanical flexibility and robustness of 2D materials make them ideal for flexible and wearable electronics, opening up new possibilities for applications in healthcare, IoT, and consumer electronics.

Applications and Future Outlook

  • In-Memory Computing and Neuromorphic Devices: 2D materials-based memristors and memtransistors offer significant potential for in-memory computing and neuromorphic applications. These devices can perform logic operations and data storage simultaneously, reducing latency and power consumption compared to traditional von Neumann architectures.
  • High-Performance Logic and Memory Circuits: The review showcases various small-scale and large-scale integrated circuits based on 2D materials, including inverters, logic gates, and memory arrays. These circuits demonstrate promising performance, with high gain, low power consumption, and excellent stability, paving the way for future high-performance computing applications.
  • Future Research Directions: Future work should focus on improving the quality and scalability of 2D materials synthesis, optimizing device structures, and developing advanced fabrication techniques. Additionally, exploring the integration of 2D materials with existing silicon-based technologies will be crucial for realizing their full potential in commercial applications.

This review by Laixiang Qin and Li Wang provides a comprehensive overview of the role of 2D materials in the future of electronics and integrated circuits. By highlighting their unique properties, advanced device structures, and potential applications, the review underscores the importance of 2D materials in overcoming the limitations of traditional semiconductors and enabling next-generation computing technologies. Stay tuned for more exciting developments as researchers continue to explore the vast potential of 2D materials in various fields.

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Materials for Devices
Physical Sciences > Materials Science > Materials for Devices
Electronic Circuits and Systems
Technology and Engineering > Electrical and Electronic Engineering > Electronic Circuits and Systems
Nanoscale Design, Synthesis and Processing
Physical Sciences > Materials Science > Nanotechnology > Nanoscale Design, Synthesis and Processing
Two-dimensional Materials
Physical Sciences > Physics and Astronomy > Condensed Matter Physics > Semiconductors > Two-dimensional Materials
  • Nano-Micro Letters Nano-Micro Letters

    Nano-Micro Letters is a peer-reviewed, international, interdisciplinary and open-access journal that focus on science, experiments, engineering, technologies and applications of nano- or microscale structure and system in physics, chemistry, biology, material science, and pharmacy.