Mario Lanza

Associate Professor, National University of Singapore
  • Singapore

About Mario Lanza

Mario Lanza is an IEEE Fellow and Associate Professor of Materials Science and Engineering at the National University of Singapore. His research focuses on improving electronic devices, integrated circuits, and silicon microchips using novel nanomaterials. He has published over 200 research articles in top journals including Nature, Science and Nature Electronics, and he has been plenary, keynote, tutorial and invited speaker in over 150 conferences. For this work, he and his students have received some of the most prestigious awards in the world, and his articles have been highly cited. He is often consulted by leading semiconductor companies and top publishers. He is an active member of the board of governors of the IEEE - Electron Devices Society, and has been involved in the technical and management committee of top conferences in the field of micro/nano electronics, including IEDM and IRPS. He speaks fluently 5 languages: English, Chinese, German, Spanish and Catalan.

Intro Content

Nature Electronics

Wafer-scale integration of 2D materials in high-density memristive crossbar arrays for artificial neural networks

Memristors made of multilayer hexagonal boron nitride exhibit multiple properties (such as ultra-low power consumption and multiple stable states) that make them ideal for the construction of crossbar arrays for artificial neural networks.

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Recent Comments

Jan 04, 2022

Very nice paper and prototype, congratulations for the excellent work ! As a constructive observation, the endurance plot could be improved by presenting one data point per cycle instead of one data point per decade (see also M. Lanza et al. ACS Nano 2021, 15, 11, 17214–17231, also available here: https://pubs.acs.org/doi/10.1021/acsnano.1c06980).

Feb 24, 2021

Congratulations, outstanding work in the field of 2D materials !

Dec 08, 2020

Wonderful work, congratulations !

Sep 22, 2020

That is a very attractive work because it goes towards wafer scale integration and shows variability information. Congratulations to the authors !

Aug 25, 2020

Excellent work, congratulations to the entire team !

Aug 25, 2020

This is a fantastic work because it really addresses the problem of 2D solid-state microelectronic devices and circuits, which is integration and device-to-device variability. Congratulations to all the authors.

Nov 12, 2019

Congratulations Chetan ! Very beautiful stuff, I feel very happy for you. Well deserved !

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